1 sheet no.: d1-a02001en date march 30, 2007 ?sharp corporation PT480FE0000F PT480FE0000F phototransistor notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. side view detection type 2. plastic mold with resin lens 3. narrow directivity angle 4. visible light cut-off resin 5. lead free and rohs directive component agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 6 applications 1. optoelectronic switches 2. automatic stroboscopes 3. office automation equipment 4. audio visual equipment 5. home appliances 6. telecommunication equipment 7. measuring equipment 8. tooling machines 9. computers
sheet no.: d1-a02001en 2 PT480FE0000F outline dimensions r0. 8 0.1 2-c0.5 2.15 2.95 (6) 1.6 (6) (6) (6) (6) (6) 2. 8 (2.54) 3.0 0.15 0.2 max. resin bu rr 0.5 max. gate bu rr 1.0 max. resin bu rr 0.5 mi n . 17.5 1.4 (1.7) 1.5 4.0 +1.5 -1.0 2 - 0.4 0.5 0.75 1.15 60 4 2 - 0.45 2 - 0. 8 7 4 4 0.15 max. 4 1.5 e. pi n r0.5 1 2 1 2 1 2 emitter collector no. name pin arran g ement terminal connection notes: 1. units: mm 2. unspecified tolerence: 0.2 mm 3. ( ): reference dimensions 4. package: v isi b le light c u t-off epoxy resin ( b lack) 5. the thin bu rr thickness (0.05 mm max.) and the gate bu rr (0.5 mm max.) are not incl u ded in o u tline dimensions 6. resin protr u sion: 1.0 mm max. ho w e v er, the thin bu rr adheres to the lead 1.4 mm max. from the resin +0.3 -0.1 +0.3 -0.1
sheet no.: d1-a02001en 3 PT480FE0000F absolute maximum ratings * 1 5 s (max.) positioned 1.4 mm from resin edge. see figure 4. electro-optical charactertistics * 1 ee: irradiance by cie standard light source a (tungsten lamp) parameter symbol rating unit collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 20 ma collector power dissipation p c 75 mw operating temperature topr -25 to +85 c storage temperature tstg -40 to +85 c soldering temperature *1 tsol 260 c parameter symbol conditi ons *1 min. typ. max. unit collector current i c ee = 1 mw/cm 2 , v ce = 5 v 0.25 0.8 3.0 ma dark current i ceo ee = 0, v ce = 20 v ? 1.0 100 na collector-emitter saturation voltage v ce(sat) ee = 10 mw/cm 2 , i c = 0.5 ma ? 0.1 0.4 v collector-emitter breakdown voltage bv ceo i c = 0.1 ma, ee = 0 35 ? ? v emitter-collector breakdown voltage bv eco i e = 0.01 ma, ee = 0 6 ? ? v peak sensitivity wavelength p ? ? 860 ? nm response time (rise) tr v ce = 2 v, i c = 2 ma, rl = 100 ?3.0 ?s response time (fall) tf ? 3.5 ? s fig. 1 collector po wer dissipation vs. ambient temperature 8 0 70 75 60 50 40 30 20 15 10 0 -25 0 25 am b ient temperat u re ta (c) collector po w er dissipation pc (m w ) 50 75 8 5100 fig. 2 spectral sensitivity 100 8 0 ta = 25c 60 40 20 0 400 500 600 700 w a v elength (nm) 8 00 900 1,000 1,100 relati v e sensiti v ity (%) (ta = 25c) (ta = 25c)
sheet no.: d1-a02001en 4 PT480FE0000F packing specifications fig. 3 packing method inner packin g v inyl b ag w ith prod u cts (2 b ags) cellophane tape packing case model n o., q u antity, and lot n o. c u shioning material (2 sheets) v inyl b ag prod u ct (1,000 pieces) notes: 1. inner packing material : v inyl b ag (polyethylene) 2. q u antity: 1,000 pieces/ b ag notes: 1. o u ter material : packing case (corr u gated card b oard), c u shioning material (urethane), cellophane tape 2. q u antity: 2,000 pieces/ b ox 3. reg u lar packaged mass: approximately 270 g 4. indication: model n o., q u antity, and lot n o. outer packin g c u shioning material (2 sheets)
sheet no.: d1-a02001en 5 PT480FE0000F packing specifications 1. parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag. 2. bags are secured in a box as shown in the illustration on page crossreference. 3. product mass: 0.09 g (approximately) design notes 1. this product is not designed to resist el ectromagnetic and ionized-particle radiation. manufacturing guidelines cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. soldering instructions 1. sharp does not recommend using preheat or solder reflow methods when soldering this part. 2. if hand soldering, use temperatures 260c for 5 seconds. 3. when mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. fig. 4 soldering area 1.4 mm soldera b le
sheet no.: d1-a02001en 6 PT480FE0000F presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared emitting diode ??????
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a02001en 7 PT480FE0000F
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